ENGINEER, OMT RAM RDA PROCESS
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 2-8 yearsSkills: ["Process improvement","Root cause analysis","Troubleshooting","Cross-functional collaboration","Defect analysis"]Identify yield-gain opportunities and implement baseline improvement programs to drive yield enhancements. Set up and maintain accurate process control charts, manage reaction mechanisms, and collaborate with Process Integration and Production to meet yield and performance goals. Investigate defects tied to SWRs, run contamination/defect/performance qualification procedures, and characterize process responses to define process margins. Troubleshoot wafer fabrication issues using root-cause analysis and support new product qualification by recommending process adjustments or equipment changes.
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