Principal Process Engineer, Die Bonding

Micron Technology
Boise
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 8+ yearsEducation: bachelorsSkills: ["Problem-solving","Communication","Data analysis","Attention to detail","Self-motivation"]

Drive the start-up, development, and optimization of die bonding processes to improve semiconductor product yield, quality, reliability, and cost. Lead process and equipment/material evaluation initiatives, manage risk, and troubleshoot manufacturing line issues using failure analysis and structured problem-solving methods (FMEA, 8D, SPC/FDC). Support internal and external audits, validate new process baselines, and collaborate closely with global suppliers and manufacturing teams to implement and improve advanced packaging technologies.

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FursaFursa
Micron Technology
Micron Technology
3 months ago

Principal Process Engineer, Die Bonding

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Last checked: 17 hours agoStatus: Live

Job Summary

Drive the start-up, development, and optimization of die bonding processes to improve semiconductor product yield, quality, reliability, and cost. Lead process and equipment/material evaluation initiatives, manage risk, and troubleshoot manufacturing line issues using failure analysis and structured problem-solving methods (FMEA, 8D, SPC/FDC). Support internal and external audits, validate new process baselines, and collaborate closely with global suppliers and manufacturing teams to implement and improve advanced packaging technologies.
Location: Boise
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Mid level

Key Responsibilities

  • •Develop, diagnose, and resolve die bonding process technologies and manufacturing line problems.
  • •Coordinate process, equipment, and material evaluation/optimization initiatives and implement changes at process steps.
  • •Lead and participate in continuous yield improvement and cost reduction activities.
  • •Validate and fan out new process baselines (new processes, tools, and/or materials) for new product introduction.
  • •Manage, audit, and liaise with material suppliers to meet quality, cost, and risk management objectives; support internal/external audits.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid LeavePaid HolidaysParental Leave

Key Requirements

  • •BS degree with 8+ years of proven experience in semiconductor process engineering.
  • •Strong engineering knowledge of semiconductor advanced packaging die stacking and die bonding processes.
  • •Ability to design valid tests and run Design of Experiments (DOE).
  • •Strong data collection, organization, and analysis skills, including proficiency with data analysis techniques/programs.
  • •Excellent oral/written communication and attention to detail, with the ability to work independently and collaboratively (including as a group leader).
Experience:8+ yearsSemiconductorAdvanced packagingDie bonding
Education:Bachelor's
Skills:Problem-solvingCommunicationData analysisAttention to detailSelf-motivation
Tech Stack:Die bondingFusion bondingHybrid bondingDirect bondingFMEA8DSPCFDCDOERMSAPCFailure analysisContinuous yield improvement

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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