ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

Micron Technology
Singapore
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityEducation: phdSkills: ["Analytical thinking","Critical thinking","Communication","Collaboration","Continuous improvement"]

Work as an individual contributor on advanced packaging in Singapore, supporting next-generation memory/HBM packaging and transitioning new products from development to high-volume manufacturing. You’ll partner with packaging technology development, manufacturing, and suppliers to run low-volume manufacturing and run-at-risk. The role focuses on accelerating learning using engineering/statistical methods (DOE), performing FMEA/risk assessments, enabling technology transfer, and improving efficiency and quality with AI-enabled tools.

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FursaFursa
Micron Technology
Micron Technology
2 months ago

ENGINEER, High Bandwidth Memory (HBM) & New Product Introduction (NPI)

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Source: Company careers pageValidated by: Fursa AI
Last checked: 18 hours agoStatus: Live

Job Summary

Work as an individual contributor on advanced packaging in Singapore, supporting next-generation memory/HBM packaging and transitioning new products from development to high-volume manufacturing. You’ll partner with packaging technology development, manufacturing, and suppliers to run low-volume manufacturing and run-at-risk. The role focuses on accelerating learning using engineering/statistical methods (DOE), performing FMEA/risk assessments, enabling technology transfer, and improving efficiency and quality with AI-enabled tools.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community

Key Responsibilities

  • •Integrate AI-assisted tools and insights into daily work to improve efficiency, quality, and effectiveness.
  • •Use engineering and statistical methods to accelerate learning cycles from Design of Experiments (DOE) through product qualifications.
  • •Partner with advanced package technology development and manufacturing teams to support Low Volume Manufacturing (LVM) and Run at Risk (RAR).
  • •Perform risk assessments including Failure Mode & Effect Analysis (FMEA) and implement control plans and corrective actions for abnormal conditions.
  • •Enable smooth technology transfer from development to high-volume manufacturing.

Key Requirements

  • •PhD in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or a related discipline.
  • •Operations support, including shift and weekend coverage, is required.
  • •Strong analytical, logical, and critical thinking skills.
  • •Ability to collaborate effectively across all levels with strong communication skills.
  • •Baseline digital fluency and role-appropriate AI literacy to use AI-enabled tools responsibly for research, analysis, and problem-solving.
Experience:Semiconductor industry
Education:PhD / Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related discipline
Skills:Analytical thinkingCritical thinkingCommunicationCollaborationContinuous improvement
Tech Stack:AI-enabled toolsAI literacyMES systemsAutomationData analytics toolsJMPPythonAutoCADAspen HYSYSFMEADOE

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn