Applied Materials

3 months ago

NPME II

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 5 hours agoStatus: Live

Job Summary

Work within a cross-functional Integrated Design Team to support the development and successful release of advanced semiconductor capital equipment products into high-volume manufacturing. Build and maintain Bills of Materials, family trees, and DFX materials; develop installation tooling concepts; perform virtual analysis/build using 3D CAD; estimate and validate labor hours and cycle times; and drive manufacturability and corrective actions through change control and root-cause analysis.

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Participate in cross-functional Integrated Design Team activities to support product development and release into high-volume manufacturing.
•Develop, implement, and release Bills of Materials (BOMs) and create/maintain family trees to support proper product structure releases.
•Provide DFX feedback and maintain DFX scorecards; develop and update DFX Best Known Methods (BKMs) with stakeholders.
•Perform root cause analysis for manufacturing issues across piece parts, subassemblies, module integration, final assembly, and/or test; drive corrective actions and failure analysis reporting.
•Use virtual analysis/build of 3D models to identify interferences and access restrictions, estimate labor hours and cycle times, and manage engineering changes (ECRs/ECOs) through change control processes.

Travel: Low travel

Pay and Benefits

Salary: USD 78,500 - 108,000 annually

Equity and Bonus:Equity

Key Requirements

•Bachelor’s degree in an engineering discipline (mechanical, electrical, manufacturing, or industrial) or other education with relevant experience.
•Experience using 3D CAD systems, with specific experience using PTC Creo a plus.
•Experience with mechanical analysis software packages, specifically ANSYS, a plus.
•Familiarity with MRP systems and function; SAP knowledge is a plus.
•Practical experience with lean continuous improvement is a plus.

Experience:Semiconductor capital equipmentManufacturingEngineering3D CAD

Education:Bachelor's in engineering discipline

Skills:Team collaborationProblem-solvingCommunicationRoot cause analysis

Tech Stack:3D CADPTC CreoANSYSMRPSAPVirtual analysisVirtual build3D solid models

Company Brief

Applied Materials

Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor

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Applied Materials

3 months ago

NPME II

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 5 hours agoStatus: Live

Job Summary

Location: United States

Workplace: Onsite

Employment Type: Full time

Job Function: Product Management

Seniority: Mid level

Key Responsibilities

•Participate in cross-functional Integrated Design Team activities to support product development and release into high-volume manufacturing.
•Develop, implement, and release Bills of Materials (BOMs) and create/maintain family trees to support proper product structure releases.
•Provide DFX feedback and maintain DFX scorecards; develop and update DFX Best Known Methods (BKMs) with stakeholders.
•Perform root cause analysis for manufacturing issues across piece parts, subassemblies, module integration, final assembly, and/or test; drive corrective actions and failure analysis reporting.
•Use virtual analysis/build of 3D models to identify interferences and access restrictions, estimate labor hours and cycle times, and manage engineering changes (ECRs/ECOs) through change control processes.

Travel: Low travel

Pay and Benefits

Salary: USD 78,500 - 108,000 annually

Equity and Bonus:Equity

Key Requirements

•Bachelor’s degree in an engineering discipline (mechanical, electrical, manufacturing, or industrial) or other education with relevant experience.
•Experience using 3D CAD systems, with specific experience using PTC Creo a plus.
•Experience with mechanical analysis software packages, specifically ANSYS, a plus.
•Familiarity with MRP systems and function; SAP knowledge is a plus.
•Practical experience with lean continuous improvement is a plus.

Experience:Semiconductor capital equipmentManufacturingEngineering3D CAD

Education:Bachelor's in engineering discipline

Skills:Team collaborationProblem-solvingCommunicationRoot cause analysis

Tech Stack:3D CADPTC CreoANSYSMRPSAPVirtual analysisVirtual build3D solid models

Company Brief

Applied Materials

Industry: Industrial Machinery

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Santa Clara, United States

Founded: 1967

Glassdoor: 3.9

Website LinkedIn Glassdoor