Senior Packaging Technical Engineer - Hardware

NVIDIA
Santa Clara, Texas, United States
Workplace: HybridFull timeUSD 168,000 - 322,000 annuallyFunction: Solutions Engineering & Sales EngineeringExperience: 8+ yearsEducation: bachelorsSkills: ["Proactive ownership","Communication","Problem-solving","Works independently","Cross-functional collaboration"]

Define and implement chip pad rings, substrate interconnect schemes, and package layout design. Own chip floor planning and pad ring/ball-out work while partnering with Circuit, Signal Integrity, RTL, Place & Route, substrate layout, and system design teams. Apply transmission line, power delivery, and signal integrity fundamentals to deliver robust, world-class electrical packaging, communicating cross-functionally and solving complex technical problems.

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NVIDIA
NVIDIA
3 days ago

Senior Packaging Technical Engineer - Hardware

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Last checked: 3 hours agoStatus: Live

Job Summary

Define and implement chip pad rings, substrate interconnect schemes, and package layout design. Own chip floor planning and pad ring/ball-out work while partnering with Circuit, Signal Integrity, RTL, Place & Route, substrate layout, and system design teams. Apply transmission line, power delivery, and signal integrity fundamentals to deliver robust, world-class electrical packaging, communicating cross-functionally and solving complex technical problems.
Location: Santa Clara, Texas, United States
Workplace: Hybrid
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering
Seniority: Mid level

Key Responsibilities

  • •Define and implement the chip pad ring, substrate interconnect scheme, and package layout design process.
  • •Work on chip floor plan, pad ring, substrate, and ball out implementation for robust electrical packaging.
  • •Collaborate with Circuit, Signal Integrity, RTL, Place and Route, substrate layout, and system design teams.
  • •Communicate effectively with various internal teams to drive packaging technology across functions.
  • •Contribute to solving complex technical packaging problems.

Pay and Benefits

Salary: USD 168,000 - 322,000 annually
Equity and Bonus:Equity

Key Requirements

  • •BSEE or equivalent experience.
  • •Minimum 8+ years in board/system design.
  • •Experience with package design is preferred.
  • •Strong understanding of transmission line theory, power delivery, and signal integrity.
  • •Preferred: programming/scripting skills in Perl, Python, or Tcl; Cadence and Excel familiarity is a plus.
Experience:8+ years
Education:Bachelor's
Skills:Proactive ownershipCommunicationProblem-solvingWorks independentlyCross-functional collaboration
Tech Stack:PerlPythonTclCadenceExcel

Company Brief

NVIDIA
Designs and manufactures GPUs, AI accelerators, and system-on-chip products for gaming, data centers, professional visualization, and automotive markets, enabling advanced graphics, AI, and high-performance computing solutions worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1993
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