Semiconductor Packaging Integration Research Manager

Intel
Phoenix
Workplace: HybridFull timeUSD 220,920 - 311,890 annuallyFunction: Research & Scientific (R&D)Experience: 7+ yearsEducation: mastersSkills: ["Cross-functional collaboration","Communication","Executive-level storytelling","Risk framing","Technical leadership"]

Lead advanced semiconductor packaging integration research to enable next-generation heterogeneous technology and systems. Define integration strategies and technical roadmaps spanning package architecture, chiplet assembly, substrates/interposers, and wafer-level/die-level reliability. Manage multidisciplinary teams and partner across device, design, process, reliability, test, thermal, and manufacturing to close cross-domain gaps through feasibility demonstrations, technology readiness assessments, and research-to-development transfer.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Intel
Intel
1 day ago

Semiconductor Packaging Integration Research Manager

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 2 hours agoStatus: Live

Job Summary

Lead advanced semiconductor packaging integration research to enable next-generation heterogeneous technology and systems. Define integration strategies and technical roadmaps spanning package architecture, chiplet assembly, substrates/interposers, and wafer-level/die-level reliability. Manage multidisciplinary teams and partner across device, design, process, reliability, test, thermal, and manufacturing to close cross-domain gaps through feasibility demonstrations, technology readiness assessments, and research-to-development transfer.
Location: Phoenix
Workplace: Hybrid
Employment Type: Full time
Job Function: Research & Scientific (R&D)
Seniority: Manager level

Key Responsibilities

  • •Lead packaging integration research programs across heterogeneous integration, chiplets, 2.5D/3DIC, hybrid bonding, wafer-level packaging, and emerging die-to-die interconnect technologies.
  • •Define integration research strategy, technical roadmaps, research milestones, and decision criteria aligned to platform and system-level scaling requirements.
  • •Manage multidisciplinary teams spanning integration research, packaging technologists, process integration, modeling, design, and technical program leads.
  • •Translate system requirements into package integration solutions balancing performance, power, area, latency, bandwidth, thermal behavior, mechanical stress, reliability, cost, and manufacturability.
  • •Drive feasibility studies, technology readiness assessments, risk reviews, reliability evaluations, and research-to-development transfer; communicate progress and recommendations to senior technical and business leaders.

Pay and Benefits

Salary: USD 220,920 - 311,890 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •Demonstrated experience leading advanced technology research programs and multidisciplinary technical teams or cross-functional initiatives.
  • •Ability to turn ambiguous integration challenges into clear hypotheses, experimental plans, measurable milestones, and technology readiness criteria.
  • •Strong understanding of package-system integration, chiplet architectures, advanced interconnects, substrates/interposers, wafer-level processes, and reliability/manufacturability trade-offs.
  • •Strong communication skills to present complex technical findings, trade-offs, risks, and recommendations to executive and technical audiences.
  • •Master’s degree in relevant engineering/science discipline; Ph.D. preferred, with a minimum of 7 years of semiconductor technology experience.
Experience:7+ yearsSemiconductor manufacturingAdvanced packaging researchHeterogeneous integrationChipletsResearch-to-development transfer
Education:Master's
Skills:Cross-functional collaborationCommunicationExecutive-level storytellingRisk framingTechnical leadership
Tech Stack:Si-Package co-optimizationChiplets2.5D3DICHybrid bondingInterposer technologySubstrate technologyWafer-level packagingDie-to-die interconnectModelingSimulationPrototypingDesign-of-experimentsFailure analysisThermal-mechanical modelingHPCAI

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
Glassdoor
Glassdoor: 3.8
WebsiteLinkedInGlassdoor