Optoelectronic IC Package Design Director

Ciena
United States
Workplace: OnsiteFull timeUSD 235,600 - 376,400 annuallyFunction: Design (Product/UX/UI/Visual)Experience: 10+ yearsEducation: bachelorsSkills: ["Problem solving","Engineering fundamentals"]

Lead optoelectronic IC package development for custom in-house photonic, analog, and digital ICs within the xPO engineering team. Own advanced package selection, BGA configuration, and package structure, drive development schedules, and ensure successful design verification and tapeout. Optimize silicon floorplan, bump, and pin-out trade-offs with signal/power integrity and RF performance simulations, coordinating across cross-functional teams plus CMs and vendors.

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FursaFursa
Ciena
Ciena
1 day ago

Optoelectronic IC Package Design Director

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Job Summary

Lead optoelectronic IC package development for custom in-house photonic, analog, and digital ICs within the xPO engineering team. Own advanced package selection, BGA configuration, and package structure, drive development schedules, and ensure successful design verification and tapeout. Optimize silicon floorplan, bump, and pin-out trade-offs with signal/power integrity and RF performance simulations, coordinating across cross-functional teams plus CMs and vendors.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Design (Product/UX/UI/Visual)
Seniority: Director level

Key Responsibilities

  • •Own and drive advanced package selection, new product BGA configuration, and package structure.
  • •Own and manage package development schedules.
  • •Perform package layout, SI/PI optimization, design verification, and tapeout.
  • •Simulate and optimize signal and power integrity and RF performance of the package design.
  • •Coordinate with cross-functional groups and work with CMs and vendors on package selection, feasibility, sourcing, and future development.

Pay and Benefits

Salary: USD 235,600 - 376,400 annually
Equity and Bonus:Equity
Perks:Health InsuranceDentalVision401kPaid HolidaysPaid Leave

Key Requirements

  • •BS in Electrical Engineering or Physics (master’s or Ph. D degree is a plus).
  • •10+ years of hands-on experience in IC package design.
  • •Proficiency with SI/PI and EM simulation tools such as SIWave and HFSS.
  • •Experience using Advanced Package Designer (APD)+SIP and/or Xpedition Package Designer (XPD) (Cadence highly preferred).
  • •Experience in package design electrical review, SI/PI analysis, and manufacturing reviews.
Experience:10+ yearsIC package designHigh-speed connectivity
Education:Bachelor's in Electrical Engineering or Physics
Skills:Problem solvingEngineering fundamentals
Tech Stack:CadenceAdvanced Package Designer (APD)SIPXpedition Package Designer (XPD)SIWaveHFSSSI/PIEM simulation2.5-D IC3-D IC interposers

Company Brief

Ciena
Provides networking systems, software, and services that enable service providers, cloud operators, and enterprises to deliver high-capacity connectivity and adaptive network solutions worldwide.
Industry: Networking Equipment
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Hanover, United States
Founded: 1992
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Glassdoor: 3.8
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