Packaging Module Equipment Development Engineer

Develop semiconductor packaging technologies within Intel’s Advanced Packaging Technology Manufacturing (APTM) organization. You’ll advance first/second-level interconnect, thermal solutions, and SMT/PCB technologies, collaborate cross-functionally to improve quality, reliability, yield, and manufacturability, and innovate next-generation equipment, materials, and fabrication processes. Manage project timelines, provide sustaining support for equipment performance in high-volume manufacturing, and respond to foundry customer requests.