Back End( BE) Process Integration Engineer

Intel
United States
Workplace: OnsiteFull timeUSD 103,730 - 170,630 annuallyFunction: Communications, PR & CommunityEducation: phdSkills: ["Root cause analysis","Analytical thinking","Communication","Experiment design","Stakeholder influence"]

Develop and define integrated front-end and back-end process flows for new semiconductor technology nodes. Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams to optimize RC performance and establish process windows. Analyze yield loss and parametric failures, perform root cause analysis using statistical methods, and drive corrective actions to improve yield and cycle time while supporting ramp from R&D to high-volume manufacturing.

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Intel
Intel
5 hours ago

Back End( BE) Process Integration Engineer

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Job Summary

Develop and define integrated front-end and back-end process flows for new semiconductor technology nodes. Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams to optimize RC performance and establish process windows. Analyze yield loss and parametric failures, perform root cause analysis using statistical methods, and drive corrective actions to improve yield and cycle time while supporting ramp from R&D to high-volume manufacturing.
Location: United States
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Entry level

Key Responsibilities

  • •Develop and define integrated front-end and back-end process flows for new technology nodes.
  • •Coordinate across lithography, etch, deposition, diffusion, wet clean, CMP, dielectric, and metrology teams.
  • •Optimize RC performance by establishing process windows and integration schemes.
  • •Analyze yield loss and parametric failures; perform root cause analysis using SPC, DOE, and FMEA and drive corrective actions.
  • •Implement control plans and process monitoring strategies, ensure reliability margins, and support ramp from R&D to high-volume manufacturing while documenting SOPs.

Pay and Benefits

Salary: USD 103,730 - 170,630 annually
Equity and Bonus:Equity
Perks:Health InsuranceRetirementPaid Leave

Key Requirements

  • •PhD in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Optics, or a closely related semiconductor field.
  • •Hands-on cleanroom experience in interconnect process development (BEOL integration) and advanced interconnect metallization (Cu, Co, Ru, Mo, or emerging metals).
  • •Electrical characterization of interconnect stacks (RC, EM, reliability) and cleanroom process development in a university or industry fab environment.
  • •Deep understanding of RC delay, electromigration, TDDB, via resistance, and low-k dielectric integration.
  • •Ability to design experiments, analyze results, and drive process improvements with strong analytical and presentation skills.
Education:PhD / Doctorate in Electrical Engineering, Physics, Applied Physics, Materials Science, Chemical Engineering, Mechanical Engineering, Chemistry, Optics, or a closely related semiconductor field
Skills:Root cause analysisAnalytical thinkingCommunicationExperiment designStakeholder influence
Tech Stack:SPCDOEFMEAJMPPythonSQLMATLABJSLTCLKLAApplied Materials review toolsCpkPpkControl charts

Company Brief

Intel
Designs and manufactures semiconductor chips, processors, and related hardware for PCs, data centers, networking, and embedded applications, while providing software and services to accelerate computing across industries globally.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1968
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Glassdoor: 3.8
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