Staff / Principal Wafer Bond Process Development Engineer

Micron Technology
Boise, Idaho
Workplace: OnsiteFull timeFunction: Communications, PR & CommunitySkills: ["Analytical problem-solving","Leadership","Cross-functional collaboration","Independent project leadership","Communication"]

Develop and optimize wafer bonding process technology for next-generation DRAM in Micron’s DRAM Technology Development group. Lead experimental design (DOEs), evaluate and qualify new equipment/materials/process technologies, and drive yield improvements, cost reduction, and productivity using data-driven problem solving. Collaborate with manufacturing, suppliers, and cross-functional teams to resolve line challenges, establish process baselines, and incorporate changes across process steps, leveraging AI/ML/LLM tools for efficiency.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Staff / Principal Wafer Bond Process Development Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 13 hours agoStatus: Live

Job Summary

Develop and optimize wafer bonding process technology for next-generation DRAM in Micron’s DRAM Technology Development group. Lead experimental design (DOEs), evaluate and qualify new equipment/materials/process technologies, and drive yield improvements, cost reduction, and productivity using data-driven problem solving. Collaborate with manufacturing, suppliers, and cross-functional teams to resolve line challenges, establish process baselines, and incorporate changes across process steps, leveraging AI/ML/LLM tools for efficiency.
Location: Boise, Idaho
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Develop and optimize wafer bonding processes to enable next-generation DRAM technologies.
  • •Plan and execute DOEs to improve process performance, product quality, and reliability.
  • •Drive yield improvement, cost reduction, and productivity initiatives using data-driven problem solving.
  • •Evaluate and qualify new equipment, materials, and process technologies for development and manufacturing.
  • •Collaborate with manufacturing, suppliers, and cross-functional teams to resolve issues and implement process improvements.

Pay and Benefits

Perks:Health InsuranceDentalVisionSavingsPaid Leave

Key Requirements

  • •PhD (3+ years), or Master’s (5+ years), or Bachelor’s (7+ years) in relevant semiconductor industry experience.
  • •5+ years developing and driving wafer bonding technologies, process integration, or related semiconductor manufacturing processes.
  • •Hands-on experience with direct bonding, hybrid bonding, wafer thinning, de-bonding, or other advanced bonding technologies.
  • •Strong analytical and problem-solving skills, with the ability to lead complex technical challenges using data-driven decisions.
  • •Ability to work across cross-functional teams and independently lead projects, influencing technical direction to deliver results.
Experience:SemiconductorDRAMMemoryWafer bondingManufacturing
Skills:Analytical problem-solvingLeadershipCross-functional collaborationIndependent project leadershipCommunication
Tech Stack:AIMLLLM

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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