Broadcom

1 day ago

Package Design Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Design and deliver high-performance flip-chip BGA ASIC packaging for advanced AI, networking, HPC, and 5G applications. Own package layout/routing and key electrical considerations including impedance matching, crosstalk, and signal/power integrity, plus manufacturability, reliability, and thermal. Work on critical high-frequency/datarate structures for SerDes, ADC/DAC, DDR, and HBM, coordinating schedules across multiple projects with a worldwide R&D team.

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Seniority: Mid level

Key Responsibilities

•Own ASIC package design responsibilities (layout/routing) including impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, with package engineering experts.
•Design critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, and related components.
•Schedule, prioritize, and track work across multiple simultaneous package design projects.
•Perform general flip-chip BGA package design and engineering.

Key Requirements

•B.Eng (EE/EEE) or similar with 5+ years of experience in flip-chip BGA package design, including high-speed SerDes.
•M.Eng (EE/EEE) or similar with 3+ years of experience in flip-chip BGA package design, including high-speed SerDes.
•Knowledge of package-level signal integrity and power integrity to apply to package designs.
•Cadence APD (Allegro Package Designer) experience (preferred), with equivalent tools considered.
•Ability to cooperate with a worldwide, multiple time-zone team and manage multiple package design projects.

Experience:5+ yearsASICSemiconductorSerDesAINetworkingHPC5G

Education:Bachelor's in EE/EEE

Skills:OrganizationalTask managementCollaborationCo-design

Tech Stack:Flip-chip BGASerDesRF/microwaveADCDACDDRHBMCadence APDAllegro Package DesignerImpedance matchingCrosstalkSignal integrityPower integrity2.5D3DIC

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn

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Broadcom

1 day ago

Package Design Engineer

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI

Last checked: 8 hours agoStatus: Live

Job Summary

Location: Singapore

Workplace: Onsite

Employment Type: Full time

Job Function: Design (Product/UX/UI/Visual)

Seniority: Mid level

Key Responsibilities

•Own ASIC package design responsibilities (layout/routing) including impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, with package engineering experts.
•Design critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, and related components.
•Schedule, prioritize, and track work across multiple simultaneous package design projects.
•Perform general flip-chip BGA package design and engineering.

Key Requirements

•B.Eng (EE/EEE) or similar with 5+ years of experience in flip-chip BGA package design, including high-speed SerDes.
•M.Eng (EE/EEE) or similar with 3+ years of experience in flip-chip BGA package design, including high-speed SerDes.
•Knowledge of package-level signal integrity and power integrity to apply to package designs.
•Cadence APD (Allegro Package Designer) experience (preferred), with equivalent tools considered.
•Ability to cooperate with a worldwide, multiple time-zone team and manage multiple package design projects.

Experience:5+ yearsASICSemiconductorSerDesAINetworkingHPC5G

Education:Bachelor's in EE/EEE

Skills:OrganizationalTask managementCollaborationCo-design

Tech Stack:Flip-chip BGASerDesRF/microwaveADCDACDDRHBMCadence APDAllegro Package DesignerImpedance matchingCrosstalkSignal integrityPower integrity2.5D3DIC

Company Brief

Broadcom

Designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions for the data center, networking, broadband, wireless, storage, and industrial markets worldwide.

Industry: Electronics Manufacturing

Company Size: Enterprise (1,001+ employees)

Revenue: USD 1B+

Growth: Public Company

Valuation: Public Company (Market Cap in USD)

Funding: IPO / Publicly Listed

Headquarters: Irvine, United States

Founded: 1991

Website LinkedIn