Probe TEST SOLUTION ENGINEERING (TSE)/半導体テスト開発エンジニア（プローブテスト担当）

Micron Technology
Japan
Workplace: OnsiteFull timeFunction: Solutions Engineering & Sales EngineeringSkills: []

Develop, debug, and maintain test programs for advanced semiconductor memory devices, focusing on probe (with possible scope across burn-in, final test, and module test). Own 1st silicon/NPI development through High-Volume Manufacturing (HVM). Use available (including AI-enabled) tools to improve engineering productivity, technical documentation, information summarization, issue organization, and workflow efficiency.

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FursaFursa
Micron Technology
Micron Technology
2 days ago

Probe TEST SOLUTION ENGINEERING (TSE)/半導体テスト開発エンジニア（プローブテスト担当）

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Source: Company careers pageValidated by: Fursa AI
Last checked: 9 hours agoStatus: Live

Job Summary

Develop, debug, and maintain test programs for advanced semiconductor memory devices, focusing on probe (with possible scope across burn-in, final test, and module test). Own 1st silicon/NPI development through High-Volume Manufacturing (HVM). Use available (including AI-enabled) tools to improve engineering productivity, technical documentation, information summarization, issue organization, and workflow efficiency.
Location: Japan
Workplace: Onsite
Employment Type: Full time
Job Function: Solutions Engineering & Sales Engineering

Key Responsibilities

  • •Develop, debug, and maintain test programs for advanced semiconductor memory devices.
  • •Focus on probe testing, with potential involvement across burn-in, final test, and module test areas.
  • •Drive 1st silicon/NPI development through High-Volume Manufacturing (HVM).
  • •Use available tools, including AI-enabled tools, to improve engineering productivity.
  • •Improve technical documentation, information summarization, issue organization, and workflow efficiency.

Pay and Benefits

Perks:Paid LeaveLearning BudgetWellness StipendEquityHealth Insurance

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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