Packaging Engineer, Substrate

AMD
Taiwan
Workplace: OnsiteFull timeTWD 1,691,060 - 2,415,800 annuallyFunction: Industrial, Process & Manufacturing EngineeringEducation: bachelorsSkills: ["Problem-solving","Communication","Project management","Data analysis","Teamwork"]

Drive key performance metrics for an External Manufacturing Operations (Substrate) team, ensuring stable supply of IC substrates for a leading CPU/GPU company. Manage substrate suppliers from NPI bring-up through production release, oversee NPI/LVM/HVM yield monitoring and HVM yield improvement, and lead continuous improvement projects (CIPs) using data analytics, DOE/SPC/statistical methods, and corrective actions. Lead knowledge sharing, monitor supplier scorecards, and run quarterly technical reviews.

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FursaFursa
AMD
AMD
2 days ago

Packaging Engineer, Substrate

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Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 1 hour agoStatus: Live
Reposted: similar role first listed 1 week ago

Job Summary

Drive key performance metrics for an External Manufacturing Operations (Substrate) team, ensuring stable supply of IC substrates for a leading CPU/GPU company. Manage substrate suppliers from NPI bring-up through production release, oversee NPI/LVM/HVM yield monitoring and HVM yield improvement, and lead continuous improvement projects (CIPs) using data analytics, DOE/SPC/statistical methods, and corrective actions. Lead knowledge sharing, monitor supplier scorecards, and run quarterly technical reviews.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering

Key Responsibilities

  • •Manage substrate suppliers from NPI bring-up/qualification through production release.
  • •Support substrate supplier new production site bring-up and qualification.
  • •Oversee NPI/LVM/HVM yield monitoring, sustaining, and improvements.
  • •Drive HVM yield attainment and lead sustaining issue resolution and prevention using data analytics and corrective actions.
  • •Lead knowledge-sharing initiatives and continuous improvement projects (CIPs), including supplier performance improvement/quality enhancement.

Pay and Benefits

Salary: TWD 1,691,060 - 2,415,800 annually

Key Requirements

  • •Bachelor’s or MS degree in Mechanical, Material, or Chemical Engineering.
  • •Experience in IC substrate industries, from NPI to HVM (preferred).
  • •Technical expertise in FC-BGA and LGA substrate manufacturing, assembly, and test processes.
  • •Strong statistical knowledge (DOE, SPC, 6 Sigma) and data analysis with technical report writing.
  • •Proficiency in English (speaking, writing, and presenting) with strong communication and project management skills.
Experience:IC substrateSemiconductor manufacturing
Education:Bachelor's in Mechanical or Material or Chemical Engineering
Skills:Problem-solvingCommunicationProject managementData analysisTeamwork
Languages:English
Tech Stack:NPILVMHVMBCPCIPYield monitoringFC-BGALGADOESPCSix SigmaData analyticsScorecardsCorrective actionsTechnical reviewsBest Known Methods

Company Brief

AMD
Designs and produces semiconductor products including CPUs, GPUs, and adaptive SoCs for consumer, enterprise, and embedded markets, competing across PCs, data centers, and gaming industries.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1969
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