SR ENGINEER, APTD Dry Etch Process

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Communications, PR & CommunityExperience: 4+ yearsEducation: mastersSkills: ["Independent thinking","Teamwork","Motivation","Communication"]

Drive HBM dry etch process development and yield improvement while supporting advanced packaging R&D such as chip stacking and 2.5D/3D technologies. Execute on-site projects as a technical consultant, troubleshoot complex process issues with root-cause analysis, and generate internal/external technical documentation. Contribute through cross-team work, materials characterization, and global coordination for mechanical characterization and testing, presenting data and recommendations to meet technical specifications and roadmaps.

Loading

Loading job details...

Preparing the role view and application actions.

FursaFursa
Micron Technology
Micron Technology
1 month ago

SR ENGINEER, APTD Dry Etch Process

✓ Verified Job

Canonical indexed version, validated from employer's careers page.

Source: Company careers pageValidated by: Fursa AI
Last checked: 20 hours agoStatus: Live

Job Summary

Drive HBM dry etch process development and yield improvement while supporting advanced packaging R&D such as chip stacking and 2.5D/3D technologies. Execute on-site projects as a technical consultant, troubleshoot complex process issues with root-cause analysis, and generate internal/external technical documentation. Contribute through cross-team work, materials characterization, and global coordination for mechanical characterization and testing, presenting data and recommendations to meet technical specifications and roadmaps.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Communications, PR & Community
Seniority: Mid level

Key Responsibilities

  • •Drive HBM process development and improve yield for DRY ETCH processes.
  • •Support advanced packaging technology R&D (chip stacking, 2.5D or 3D).
  • •Execute on-site project work and make decisions as a technical consultant.
  • •Troubleshoot complex problems; perform root cause analysis and resolve process engineering issues.
  • •Develop and present internal/external documentation for technical reports and presentations.

Key Requirements

  • •4+ years of experience in the semiconductor related industry.
  • •Master’s degree or higher (PhD preferred) in Chemistry, Physics, Materials, or related engineering science fields.
  • •Hands-on DRY ETCH process experience with Silicon and dielectric structures; TSV and plasma dicing experience is a plus.
  • •Innovative, with independent thinking.
  • •Strong communication in English and Chinese and ability to collaborate as a team player.
Experience:4+ yearsSemiconductorsDRY ETCHProcess developmentAdvanced packagingHBM
Education:Master's in Chemistry, Physic, Material, engineering science related fields
Skills:Independent thinkingTeamworkMotivationCommunication
Languages:EnglishChinese
Tech Stack:DRY ETCHHBMAdvanced packagingChip stacking2.5D3DMaterials characterizationMechanical characterizationPlasma dicingTSVRoot cause analysis

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn