APTD Taiwan Package Health PCS IOT Engineer

Micron Technology
Taiwan
Workplace: OnsiteFull timeFunction: Administration & Executive AssistanceSkills: ["Analytical skills","Troubleshooting skills","Self-motivation","Cross-functional collaboration","Excellent communication"]

Develop and improve smart manufacturing and process control solutions for package health, including SPC, FDC, APC, and run-to-run (R2R) control systems. Analyze data to model process variation, define monitoring strategies, control limits, dashboards, OCAPs, and automated responses. Apply ML/AI and advanced analytics, evaluate IIoT sensor/automation technologies, and lead troubleshooting and root-cause analysis across cross-functional teams.

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FursaFursa
Micron Technology
Micron Technology
6 days ago

APTD Taiwan Package Health PCS IOT Engineer

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Source: Company careers pageValidated by: Fursa AI
Last checked: 5 hours agoStatus: Live

Job Summary

Develop and improve smart manufacturing and process control solutions for package health, including SPC, FDC, APC, and run-to-run (R2R) control systems. Analyze data to model process variation, define monitoring strategies, control limits, dashboards, OCAPs, and automated responses. Apply ML/AI and advanced analytics, evaluate IIoT sensor/automation technologies, and lead troubleshooting and root-cause analysis across cross-functional teams.
Location: Taiwan
Workplace: Onsite
Employment Type: Full time
Job Function: Administration & Executive Assistance

Key Responsibilities

  • •Develop, implement, and improve smart manufacturing and process control solutions.
  • •Design and sustain SPC, FDC, APC, and R2R control systems to reduce process variation.
  • •Perform data analysis, statistical modeling, and process characterization for improvement opportunities.
  • •Develop monitoring strategies, control limits, dashboards, OCAPs, and automated responses for excursions.
  • •Evaluate and integrate IIoT technologies and sensors, and lead troubleshooting and root cause analysis.
Travel: High travel

Key Requirements

  • •Bachelor's, Master's, or PhD in Engineering, Computer Science, Statistics, Mathematics, Physics, or related disciplines.
  • •Experience in semiconductor manufacturing, process engineering, equipment engineering, or advanced packaging technology.
  • •Strong knowledge of SPC, FDC, APC, and Run-to-Run (R2R) methodologies.
  • •Experience in data analytics and statistical modeling to identify process improvement opportunities.
  • •Programming experience in Python, SQL, R, or similar data analytics tools.
Experience:Semiconductor manufacturingManufacturing automationAdvanced packagingIIoT
Education:
Skills:Analytical skillsTroubleshooting skillsSelf-motivationCross-functional collaborationExcellent communication
Tech Stack:SPCFDCAPCRun-to-Run (R2R)Machine learningAIAdvanced analyticsIIoTSensorsAutomationPythonSQLR

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
Glassdoor
Glassdoor: 3.7
WebsiteLinkedIn