Principal HBM Tapeout Execution & Release Coordination

Micron Technology
Texas
Workplace: OnsiteFull timeFunction: Executive & General ManagementSkills: ["Coordination","Release discipline","Risk management","Documentation","Stakeholder collaboration"]

Own tapeout execution and release coordination for HBM designs targeting internal Micron manufacturing. Manage tapeout schedules, DBR milestones, and release gating criteria; prepare, review, and complete tapeout collateral (including TOAST, RCDB, and TWIT) with accuracy and traceability. Coordinate cross-team prerequisites and signoff readiness items, track waivers/open items/release risks, and maintain strong release governance and hygiene across HBM programs.

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FursaFursa
Micron Technology
Micron Technology
1 week ago

Principal HBM Tapeout Execution & Release Coordination

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Source: Company careers pageValidated by: Fursa AI
Last checked: 11 hours agoStatus: Live

Job Summary

Own tapeout execution and release coordination for HBM designs targeting internal Micron manufacturing. Manage tapeout schedules, DBR milestones, and release gating criteria; prepare, review, and complete tapeout collateral (including TOAST, RCDB, and TWIT) with accuracy and traceability. Coordinate cross-team prerequisites and signoff readiness items, track waivers/open items/release risks, and maintain strong release governance and hygiene across HBM programs.
Location: Texas
Workplace: Onsite
Employment Type: Full time
Job Function: Executive & General Management

Key Responsibilities

  • •Act as tapeout execution and release coordination lead for HBM designs targeting internal Micron manufacturing.
  • •Own and manage tapeout schedules, DBR milestones, and release gating criteria.
  • •Prepare, review, and complete tapeout collateral (TOAST, RCDB, TWIT), ensuring accuracy and consistency prior to release.
  • •Coordinate with responsible teams to confirm all release prerequisites and checklist items are met before DBR.
  • •Track and escalate waivers, open items, and release risks; ensure signoff readiness closure prior to tapeout.

Pay and Benefits

Perks:Health InsuranceDentalVisionPaid Time-offPaid HolidaysParental Leave

Key Requirements

  • •Experience leading semiconductor tapeout execution and release coordination for hardware design programs.
  • •Strong ability to manage tapeout schedules, DBR milestones, and release gating criteria.
  • •Proficiency preparing and validating tapeout collateral and signoff evidence to ensure correctness, completeness, and traceability.
  • •Ability to coordinate cross-functional teams to meet release prerequisites and checklist items before DBR.
  • •Experience tracking waivers, open items, and release risks through formal tapeout governance.
Experience:Semiconductor
Skills:CoordinationRelease disciplineRisk managementDocumentationStakeholder collaboration
Tech Stack:HBMTapeoutRelease coordinationDBRTOASTRCDBTWIT

Company Brief

Micron Technology
Designs and manufactures semiconductor memory and storage solutions, including DRAM, NAND, and NOR flash, for computing, networking, mobile, and automotive markets worldwide.
Industry: Electronics Manufacturing
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Boise, United States
Founded: 1978
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Glassdoor: 3.7
WebsiteLinkedIn