Process Engineering Manager (Electroplating)

Applied Materials
Singapore
Workplace: OnsiteFull timeFunction: Industrial, Process & Manufacturing EngineeringExperience: 8+ yearsSkills: ["People leadership","Communication","Troubleshooting","Root cause analysis","Documentation"]

Lead the development and optimization of next-generation electroplating processes for advanced semiconductor packaging at the Singapore Advanced Packaging Development Center. Manage and grow a team of process engineers, drive process innovation, and oversee engineering projects from planning through execution. Partner with key customers to troubleshoot complex process engineering issues, establish new methodologies and instrumentation, and produce technical documentation, specifications, and reports that support product qualification and technology improvement.

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Applied Materials
Applied Materials
2 days ago

Process Engineering Manager (Electroplating)

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Job Summary

Lead the development and optimization of next-generation electroplating processes for advanced semiconductor packaging at the Singapore Advanced Packaging Development Center. Manage and grow a team of process engineers, drive process innovation, and oversee engineering projects from planning through execution. Partner with key customers to troubleshoot complex process engineering issues, establish new methodologies and instrumentation, and produce technical documentation, specifications, and reports that support product qualification and technology improvement.
Location: Singapore
Workplace: Onsite
Employment Type: Full time
Job Function: Industrial, Process & Manufacturing Engineering
Seniority: Manager level

Key Responsibilities

  • •Manage engineers using techniques to characterize hardware, define methods and new technologies, and perform hardware characterization on complex systems.
  • •Manage, develop, plan, and execute process engineering projects across a range of products.
  • •Interact with key customers to resolve significantly complex process engineering issues across the product range.
  • •Develop and implement new technology, products, and analytical instrumentation; train methodologies and troubleshoot using root cause analysis.
  • •Generate internal/external documentation, presentations, technical reports, and process engineering specifications for integrated products.
Travel: Low travel

Key Requirements

  • •Bachelor’s, Master’s, or PhD in Chemical Engineering, Materials Science, Chemistry, Electrical Engineering, or a related field.
  • •8+ years of semiconductor process engineering experience with hands-on electroplating/electrochemical deposition.
  • •Strong knowledge of copper plating and advanced packaging elements such as wafer-level packaging, RDL, copper pillars, and TSVs.
  • •Proven experience leading process development, technology innovation, and product qualification in an R&D environment.
  • •Demonstrated people leadership experience developing and mentoring engineering teams.
Experience:8+ yearsSemiconductor
Education:
Skills:People leadershipCommunicationTroubleshootingRoot cause analysisDocumentation
Tech Stack:ElectroplatingElectrochemical depositionCopper platingWafer-level packagingRDLCopper pillarsTSVsPlating chemistryProcess characterizationDOEStatistical analysisRoot Cause AnalysisProcess optimizationDeposition uniformityDefect reduction

Company Brief

Applied Materials
Provides semiconductor manufacturing equipment, services, and software used to build advanced chips and display technologies. Its tools support materials engineering, deposition, etching, inspection, and process control for major electronics manufacturers worldwide.
Industry: Industrial Machinery
Company Size: Enterprise (1,001+ employees)
Revenue: USD 1B+
Growth: Public Company
Valuation: Public Company (Market Cap in USD)
Funding: IPO / Publicly Listed
Headquarters: Santa Clara, United States
Founded: 1967
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